JPH0648884Y2 - 半導体装置の封止構造 - Google Patents
半導体装置の封止構造Info
- Publication number
- JPH0648884Y2 JPH0648884Y2 JP1987071846U JP7184687U JPH0648884Y2 JP H0648884 Y2 JPH0648884 Y2 JP H0648884Y2 JP 1987071846 U JP1987071846 U JP 1987071846U JP 7184687 U JP7184687 U JP 7184687U JP H0648884 Y2 JPH0648884 Y2 JP H0648884Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- semiconductor element
- moisture
- prism
- sealing structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 34
- 238000007789 sealing Methods 0.000 title claims description 13
- 239000011347 resin Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 20
- 230000003287 optical effect Effects 0.000 claims description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 239000002131 composite material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987071846U JPH0648884Y2 (ja) | 1987-05-14 | 1987-05-14 | 半導体装置の封止構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987071846U JPH0648884Y2 (ja) | 1987-05-14 | 1987-05-14 | 半導体装置の封止構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63180953U JPS63180953U (en]) | 1988-11-22 |
| JPH0648884Y2 true JPH0648884Y2 (ja) | 1994-12-12 |
Family
ID=30914769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987071846U Expired - Lifetime JPH0648884Y2 (ja) | 1987-05-14 | 1987-05-14 | 半導体装置の封止構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648884Y2 (en]) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57121285A (en) * | 1981-01-20 | 1982-07-28 | Fujitsu General Ltd | Light coupling device |
-
1987
- 1987-05-14 JP JP1987071846U patent/JPH0648884Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63180953U (en]) | 1988-11-22 |
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